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2023 R2 What's New - Ansys Mechanical

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91 ©2023 ANSYS, Inc. Contact Splitting Logic for efficient DMP Performance • The labels (MPC, BOND, NOSP and SMAL) of InterType which specify the type of contact pairs to be split are now valid in CHCH,DMP/SPLIT command • Performance improvement is dramatically for the CNCH,DMP operation (for a large auto application the operation time is reduced from several hours to a few minutes) • Solution time improvement - Splitting MPC pair and distribute sub-pairs into different domains - Distributing underlying elements of MPC pairs into different domains An auto industry model # of Cores # of Iterations Element balance ratio Elem Ass +Lnsr time Solve time Elapsed time Non split 16*2 63 2.407 6670s 1414s 8905s CNCH,DMP,,,,MPC,,TRIM 32 63 1.255 2771s 1086 4464 (2x)

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