Rand Simulation Insider: February 2023

February 22, 2023 Conrad Magalis

Rand Simulation Earns Ansys 2022 Americas Channel Partner of the Year Award
We're proud to announce that our team was awarded the Ansys 2022 Americas Channel Partner of the Year! This is the second time in four years that we've achieved this recognition.

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A Beginners Guide to SPEOS Simulation - Super Bowl Party Edition
Our optics expert takes you step-by-step through setting up a Super Bowl party simulation in Ansys SPEOS and gives you tips to find the best seat at the party!

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Ansys 2023 R1 Release Updates
Read up on the latest Ansys 2023 R1 release updates for electronics, fluids, structures, materials, and optical product lines on the Rand SIM resource center.

EXPLORE 2023 R1

Top 5 Strategies: High Electronics Systems Reliability
Insight gleaned from simulation helps build better products and reduce design cycles. Watch this video to discover how to achieve high electronics system's reliability with Rand Simulation’s proven approach.

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Enhance Your High-Performance Electronics Designs
As the need for more complex electronics and faster data output grows, the difficulty in designing and engineering these electronics increases as well. Simulation is critical in the design process as it enables you to identify problems, gain insight, and work rapidly through optimization.

VIEW OUR CAPABILITIES

About the Author

Conrad Magalis is responsible for the adoption of advanced digital engineering practices at Rand Simulation. Conrad has a broad range of experience within manufacturing and industrial industries. His acumen is focused on progressive business and engineering decisions, with practical outcomes.
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Strategic R&D Growth with Simulation

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Modeling Springs and Isolators in Ansys Mechanical

A step-by-step guide to vibration isolators in Ansys Mechanical. Vibration isolators are a critical part of...

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Rand Simulation Insider: February 2023

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Recent Blog Posts

Throughout the session, we'll delve into the capabilities of Ansys Rocky for simulating the motion and behavior of particles like gravel, tablets, wood chips, and so much more.

We'll explain the fundamentals of Ansys SPEOS and explore its capabilities for simulating light behavior in lightguides.

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Ansys’s Electronics Portfolio includes three simulation solutions that are revolutionizing the way firms design PCBs and 5G antennas.

Calling all engineers, designers, and innovators! Ansys is hosting a free, virtual, global event designed to inspire, equip, and empower you to bring your ideas to life: Simulation World 2024.

Sustainability has become a top-of-mind issue for manufacturers worldwide over the last 25 years. This has been driven in large part by global legislation like the Kyoto Protocol, Paris Agreement, the

Ansys 2024 R1 marks an improvement in simulation-driven product development, propelling advancements across key applications, including Ansys Electronics, Fluids, Structures, Optics and Photonics

Rand Simulation's FEA (Structural) Consulting Engineer, Adam LeMay, will be presenting an introduction to Ansys Sherlock for electronics reliability for enhanced product designs via simulation.

Since Ansys released the latest multi-GPU solver in its Fluent CFD software in January 2023, there has been a lot of talk about how much it speeds up calculation times.

In recent years, in silico simulations revolutionized medical device design. This blog delves into their impact and the multidisciplinary approach by leaders like Ansys.

Connecting your Engineering Workstation to an Ansys Licensing Server

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This is an end-to-end article on how to check and optimize your computer system for running Ansys simulation software.

Unlock the potential of 5G technology with Rand Simulation and Ansys in this electronics webinar. We'll explore the fundamentals of 5G, and its specific applications in antennas, connectors/PCBs

Simplifying models, choosing mesh types, and configuring hardware for simulation software all can slow down or speed up the simulation workflow. In this blog post, we’ll walk through these choices.

Printed Circuit Boards (PCBs) have multiple components that the signal travels through. No matter what components are on a PCB the signal will have to travel through a via breakout.

Taking advantage of technology advancements, the industry is moving toward Reliability Physics Analysis, or RPA, to predict electronic reliability more accurately; instead of trying to extract

Testing product designs before their development for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) issues keeps manufacturers from creating multiple product iterations

It’s more critical than ever that design teams understand the environment in which their products will operate and EMC can’t be overlooked.

Rand Simulation insider newsletter for ansys simulation topics december 2023