It’s Time to Move to Reliability Physics Analysis (RPA) for Electronics Testing

Ansys’s Electronics Portfolio includes three simulation solutions that are revolutionizing the way firms design PCBs and 5G antennas.

Electromagnetic compatibility (EMC) of complex electronic systems is essential for ensuring product success.

Simulating the effects of mobile phones on the human head using the Ansys High Frequency Structure Simulator (HFSS) in Ansys Electronics Desktop 2023.

Ansys 2023 R2 Electronics Release Notes

Ansys 2024 R1 marks an improvement in simulation-driven product development, propelling advancements across key applications, including Ansys Electronics, Fluids, Structures, Optics and Photonics

Unlock the potential of 5G technology with Rand Simulation and Ansys in this electronics webinar. We'll explore the fundamentals of 5G, and its specific applications in antennas, connectors/PCBs

Printed Circuit Boards (PCBs) have multiple components that the signal travels through. No matter what components are on a PCB the signal will have to travel through a via breakout.

Taking advantage of technology advancements, the industry is moving toward Reliability Physics Analysis, or RPA, to predict electronic reliability more accurately; instead of trying to extract

Testing product designs before their development for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) issues keeps manufacturers from creating multiple product iterations

It’s more critical than ever that design teams understand the environment in which their products will operate and EMC can’t be overlooked.