Adam LeMay

FEA Consulting Engineer

  • Printed Circuit Board Assembly Reliability Testing – The Changing Landscape

    Printed Circuit Board Assembly Reliability Testing – The Changing Landscape

    Taking advantage of technology advancements, the industry is moving toward Reliability Physics Analysis, or RPA, to predict electronic reliability more accurately; instead of trying to extract

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  • It’s Time to Move to Reliability Physics Analysis (RPA) for Electronics Testing

    It’s Time to Move to Reliability Physics Analysis (RPA) for Electronics Testing

    While the RPA methodology does not require the use of FEA tools, Ansys Sherlock has been designed from the ground up to facilitate the performance of these exact types of calculations.

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  • An Introduction to Ansys Sherlock for Electronics Reliability57:11

    An Introduction to Ansys Sherlock for Electronics Reliability

    Rand Simulation's FEA (structural) Consulting Engineer, Adam LeMay, will be presenting an introduction to Ansys Sherlock for electronics reliability for enhanced product designs via virtual testing (e

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  • Watch Now: Intro to Ansys Sherlock for Electronics Reliability

    Watch Now: Intro to Ansys Sherlock for Electronics Reliability

    Rand Simulation's FEA (Structural) Consulting Engineer, Adam LeMay, will be presenting an introduction to Ansys Sherlock for electronics reliability for enhanced product designs via simulation.

    Read Article
  • Ansys Sherlock for Evaluating Thermal Cycling

    Ansys Sherlock for Evaluating Thermal Cycling

    Ansys Sherlock is a powerful physics-based electronics reliability design tool that enables engineers to predict the life of printed circuit boards (PCBs) & electronic assemblies accurately & quickly.

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