As 5G demands faster data and smaller devices, Ansys offers electronic design solutions to tackle these challenges. Their software simulates antenna performance, ensures signal integrity on shrinking PCBs, and helps manage heat buildup, all to streamline development of next-generation 5G technology.
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In this white paper, we’ll explore how electronics designers and manufacturers are utilizing three solutions in Ansys’s Electronics Portfolio to master 5G technology: HFSS, SIwave, and Icepak.
Ansys’s Electronics Portfolio includes three simulation solutions that are revolutionizing the way firms design PCBs and 5G antennas.
42:53This webinar explores the fundamentals of 5G technology and its specific applications in various industries. Gain valuable insights from Rand Simulation and Ansys experts as they delve into: 5G Funda
1:50Given the multitude of enclosure options available, pinpointing unwanted electromagnetic sources emitted within an electronic system can be a daunting task. Rand SIM simulation experts can help.
Electromagnetic compatibility (EMC) of complex electronic systems is essential for ensuring product success.
Simulating the effects of mobile phones on the human head using the Ansys High Frequency Structure Simulator (HFSS) in Ansys Electronics Desktop 2023.
1:01:37Proper electromagnetic (EM) shielding is often essential for electronics products to successfully comply with electromagnetic compatibility (EMC) standards.
In this white paper, we provide an overview of Ansys HFSS and Ansys EMA3D Cable products and highlight ways to use them for electromagnetic simulation and design iteration.
49:46In this presentation, we will explain how Ansys EMC Plus and Ansys Charge Plus can be applied to the simulation of EMI, ESD, EMP, HIRF, and Lightning.
Ansys 2024 R1 marks an improvement in simulation-driven product development, propelling advancements across key applications, including Ansys Electronics, Fluids, Structures, Optics and Photonics
Unlock the potential of 5G technology with Rand Simulation and Ansys in this electronics webinar. We'll explore the fundamentals of 5G, and its specific applications in antennas, connectors/PCBs
Printed Circuit Boards (PCBs) have multiple components that the signal travels through. No matter what components are on a PCB the signal will have to travel through a via breakout.
Taking advantage of technology advancements, the industry is moving toward Reliability Physics Analysis, or RPA, to predict electronic reliability more accurately; instead of trying to extract
While the RPA methodology does not require the use of FEA tools, Ansys Sherlock has been designed from the ground up to facilitate the performance of these exact types of calculations.
Because manufacturers of electronic products must comply with electromagnetic interference (EMI) and electromagnetic compatibility (EMC) guidelines, suppliers to the auto industry find themselves
Testing product designs before their development for electromagnetic compatibility (EMC) and electromagnetic interference (EMI) issues keeps manufacturers from creating multiple product iterations
It’s more critical than ever that design teams understand the environment in which their products will operate and EMC can’t be overlooked.
The fact that all electronic parts must meet certain levels of electromagnetic interference and electromagnetic compatibility standards is not new. Whether you work in aerospace, automotive, etc.
