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Power Electronics Comprehensive Overview

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10 Enhanced Thermal Performance and Thermal Reliability • Ensure thermal integrity of multi-die packages in their foreseen usage scenarios • Optimize cooling strategies most appropriate to each application • Understand thermal impact on electrical and mechanical reliability • Comprehensive electro-thermal and thermo-mechanical multi-physics, allowing to assess multi-die packages behavior and address thermal management at multiple scales, up to system-level scenarios • 3D high-fidelity physics-based reduced order modeling (ROM) for highly accurate simulation speedup and models reuse • Up to 2400x faster packaging simulations across complex use cases • Simulation based lifetime predictions over multi-die packages specific use cases though thermal digital twins Automotive / Product Quality & Reliability Engineering Goals Benefits Solution Multiple Scales and Multiple Physics Solution Accuracy at All Scales Reduce Time to Market with ROM Reduced Order Model Performance compared to full 3D model

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