Issue link: https://resources.randsim.com/i/1512035
• Minimize temperature on power chips and thermal resistance of the cooling channel. • Increase number of tested configurations. • Reduce Development Time and Cost • Faster & robust preprocessing: Easy and seamless connection between CAD and Mesh (SpaceClaim/Fluent Meshing) • Automation & Optimization: Fully automated multi-objective optimization workflow via WebApp (SpaceClaim/Fluent/optiSLang) • Speed & scalability: highly-scalable HPC implementation to short the CPU time (Fluent/HPC) • Increase the number of validated configurations: • before: 10 configurations in 4 months • now: 1000s configurations in 1 month. • Maximize heat dissipation while minimizing the temperature on power chip. Case parameters selected for the optimization Streamlines for a certain parameter configuration WebApp interface to enable quick optimization cases Response Surface based on Design Points calculated in Ansys Fluent Electric Powertrain | Power Electronics Cooling Channel Multi-Objective Optimization Engineering Goals Benefits Solution