Issue link: https://resources.randsim.com/i/1512035
25 Electrothermal and Reliability Management • Increase electronics density in compact devices while keeping the smart device from overheating. • Improve electronics and battery lifetime and reliability. • Predict failure modes for variety of operating scenarios. • Accurate 3D multiphysics modeling capabilities that predict thermal failure, reflow failure and overall performance degradation. • Create a power management strategy to direct power where needed and keep overall temperatures down. • Develop solid frameworks to predict heat dissipation and allocate hotspots under given drain loads. • Extend electrothermal tests to incorporate mechanical effects to count for thermal stress deformation. • Predict electronics lifetime by computing the cumulative damage index, time to failure and life curve. • Investigate model and random vibration effects, drop test and fatigue. • Keep smartphones cooler and extend their working lifetimes, even as more features and multitasking capabilities are added in the future. Networking & Connectivity / Product Quality & Reliability Engineering Goals Benefits Solution "Qualcomm engineers used a simple state-space model in a simulation to obtain nearly the same results as a full CFD simulation but 2,400 times faster" Palkesh Jain, Principal Engineer, Qualcomm PCB warpage due to heating (delamination, component detachment, etc.) Predict solder reflow failures Mobile antenna performance degradation due to temperature