Issue link: https://resources.randsim.com/i/1512035
Automotive| Electronic Modules Automotive Electronics Reliability • Single platform: one-stop shop of Electronics reliability modeling built for automotive specifics (Sherlock/HPC) • Coverage: broad material and component library • Accuracy: simulation & physical test correlation (Sherlock/DIC microscopy) • Suggested design changes that moved the QFN package from Fail to Pass, estimated $100K saving in time & material • Reduced need of physical test & accelerate development cycle for future programs − Fewer failed tests-board spins ($50~350 k/test) − Saving overall program cycle time (8 wks/test) • Virtual reliability test of key vehicle electronics modules per specified standard: 1000hr thermal cycling (-40~80 °C) and mechanical simulation • Root cause analysis of failures seen in a QFN package at the 500 cycles functionality test. Import ECAD to Sherlock QFN Package and Damage in X-Ray Lifetime & Thermal Predictions Temperature Cycle Engineering Goals Benefits Solution