Issue link: https://resources.randsim.com/i/1512035
Thermal Shock and Cycling: Reliability • Virtual reliability test of key vehicle electronics modules per specified standard: Example: 1000hr thermal cycling (e.g. -40~80 °C) and mechanical simulation • Identification of components at greatest risk of failure due to PTC and Thermal Shock • Unified workflow: Electronics reliability modeling built for automotive specifics (Sherlock/Icepak) • Coverage: broad material and component library • Accuracy: simulation & physical test correlation (Sherlock/DIC microscopy) • Suggest design changes prior to testing to move or reduce heat on components from Fail to Pass, saving costs in time & material • Reduced need of physical test & accelerate development cycle for future programs ‐ Fewer failed tests-board spins (Ex. $50~350 k/test) ‐ Saving overall program cycle time (Ex. 8 weeks/test) Automotive Electronics Modules Engineering Goals Solution Benefits Thermal Simulation in Icepak QFN Package and Damage in X-Ray Lifetime & Thermal Predictions Temperature Cycle with Thermal Results