Brochures

Ansys Mechanical - What's New 2023 R1

Issue link: https://resources.randsim.com/i/1492512

Contents of this Issue

Navigation

Page 137 of 241

181 Coupled-Field Link Element (LINK228) • Motivation ‐ Element embedding method already adopted in electronic reliability study ‐ Many PCB/Chip components can be simulated with line elements ‐ Need for coupled-field line elements to properly capture the physics • Overview ‐ LINK228 : 3D 2-Node Coupled-Field Link ‐ Supported coupling types • Structural-Thermal , Thermal-Electric, Structural-Thermal-Electric coupling ‐ Supported analyses • Static, Transient, Harmonic ‐ Max. DOFs : UX, UY, UZ, TEMP, VOLT

Articles in this issue

view archives of Brochures - Ansys Mechanical - What's New 2023 R1