Issue link: https://resources.randsim.com/i/1543866
©2026. Proprietary. Do Not Share. 4 Key Feature 1 – Enhanced UX & Workflow Performance Enhancements Across Workflow • Benefit: Dramatically reduces overall simulation turnaround time, enabling engineers to iterate faster & complete larger, more complex thermal designs with greater efficiency. Parallelized Post-Processing Engine • Benefit: Speeds up result analysis by generating plots, summaries & solution loads much faster – allowing teams to spend less time waiting & more time making design decisions. CTM Visualization Upgrades • Benefits: Improves clarity & understanding of thermal behavior by making it easier to diagnose hotspots, analyze power distribution & validate CTM model accuracy. Geometry & Modeling Productivity Improvements • Benefit: Accelerates model setup & editing, especially for large designs, resulting in quicker model adjustments, few manual steps & smoother design workflows. Enhanced PCB & Data Workflows • Benefit: Simplifies importing, analyzing & visualizing PCB thermal data, enabling more accurate thermal predictions & eliminating manual data- handling bottlenecks. Parallelized Post-Processing Engine – Use of 8 CPU Cores CTM Solver Improvement CTM Visualization: Display Cells/Geometry Sources • Solution loading ~ 80% faster • Field plot rendering up to 400x faster • Field summaries ~ 30% faster • Case file size reduced 80% via HDF5 • CTM solve speedup to 6.5x • Boundary handling 15x faster for 30k boundaries Performance Enhancements Across Workflow