Guides
Ansys Icepak in AEDT for Thermal Integrity 2026 R1
Issue link:
https://resources.randsim.com/i/1543866
Contents of this Issue
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Articles in this issue
What's New in Ansys Icepak® in Ansys Electronics Desktop™ (AEDT) for Thermal Integrity
Ansys Icepak in AEDT 2026 R1 Key Features
Ansys Icepak in AEDT – What's New
Key Feature 1 – Enhanced UX & Workflow
Key Feature 2 – Enhanced Meshing, Solving & Physics
Key Feature 3 – System Level Thermal Integrity Solutions
Additional Features & Capabilities
Support & Help Direct Access
Slide Number 9
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