Issue link: https://resources.randsim.com/i/1543866
©2026. Proprietary. Do Not Share. 2 Ansys Icepak in AEDT 2026 R1 Key Features Enhanced User Experience (UI) & Workflow Feature Names – significant end-to-end speed up in Icepak & performance enhancements – Post-Processing + Solver + IO. Problem Solved: these optimizations drastically reduce iteration time, enabling faster thermal design cycles. Ansys Product Workflow: Users load, solve & post-process more complex thermal models dramatically faster due to parallelization, HDF5 migration & solver/UI performance boosts. System-Level Thermal Integrity Solutions Improved Meshing, Solving & Physics For Thermal Engineers, Mechanical Engineers, Electrical Engineers, Package & IC Designers, CAE Engineers, and Simulation Engineers working on electronics cooling applications Across Industries Feature Names – end-to-end productivity & performance improvement for Icepak/CTM workflows Problem Solved: it removes the delays that made thermal simulation slow & big models hard to manage. Ansys Product Workflow: users work faster across loading, solving, visualization & setup thanks to parallelization, solver OI boosts, improved CTM views, and more. Feature Names – system-level thermal integrity workflow enhancement (STM + Discovery → Icepak) Problem Solved: it solves cumbersome, click-heavy & error-prone STM setup/creation, plus manual, lossy handoffs from Discovery to Icepak that slow iterations & risk data mismatch. Ansys Product Workflow: prepare STM models faster in AEDT, then generate STMs with backend optimization & seamlessly transfer physics & boundary data from Discovery to Icepak for fast thermal solving. 2026 R1 2025 R2