Mastering 5G Technology
with Ansys Solutions
simulation@rand.com | RandSIM.com | 888.483.0674
When it comes to mobile communications, consumers want smaller devices and faster access to data. Satisfying
these demands is possible through printed circuit board (PCB) miniaturization and the 5G mobile network. Both
technological advancements, however, create design challenges for PCB and 5G antenna manufacturers.
The good news is that designers can use advanced simulation solutions to identify and address problem
areas before products ever reach manufacturing lines -- the result – is time saved and money for electronics
manufacturers and more robust products for consumers.
In this white paper, we'll explore how electronics designers and manufacturers are utilizing three solutions in Ansys's
Electronics Portfolio to master 5G technology: HFSS, SIwave, and Icepak. You can also watch our in-depth webinar
covering this topic.
Overcoming PCB Design Challenges in a 5G World
With 5G, it's essential that PCBs can support strong signals, while not losing data rates. The convergence of PCB
miniaturization and increased data speeds, however, has created four major issues for product designers.
1) Managing PCB Signal Integrity
As PCBs become smaller, higher-density interconnections require thinner traces. This degrades signal integrity.
Ansys SIwave is a specialized tool for power integrity, signal integrity, and electromagnetic interference (EMI)
analysis of integrated circuit (IC) packages and PCBs. It addresses challenges related to power delivery systems
and high-speed channels in electronic devices.
WHITEPAPER
