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3) Handling Thermal Management
Heat is a big issue as 5G speeds increase. High data rates generate more power and heat. As a result, the
materials used in PCBs and other components must withstand higher temperatures. Ansys Icepak is a
computational fluid dynamics (CFD) solver for electronics thermal management. It predicts airflow, temperature,
and heat transfer in IC packages, PCBs, electronic assemblies/enclosures, and power electronics.
When it comes to thermal management, Icepak can be used in two ways:
• A plug-in to SIwave. Icepak creates a power overlay of the board and components visible in SIwave.
• A standalone solution in Ansys Electronics Desktop. This provides more fidelity when analyzing thermal
management.
Mastering 5G Technology with Ansys Solutions
Figure 3: PCB Thermal Management with Icepak
4) Modeling Connectors
The importance of connector modeling to PCB design can't be underestimated. The size of connectors is shrinking,
while standards are becoming higher. At high speeds and frequencies, radio frequency (RF) transitions and
connector transitions have a higher impact on the signal than at lower frequencies. By accurately modeling
connectors, designers can ensure that they will get an accurate signal when conducting PCB simulations.
Ansys HFSS can help with connector modeling. This 3D electromagnetic (EM) field solver helps design high-fre-
quency, high-speed electronic components. Its finite element modeling (FEM), integral equation (IE), asymptotic,
and hybrid solvers address RF, microwave, IC, PCB, and EMI problems.
In addition, Ansys Electronics Desktop includes a free 3D component library that is integrated with HFSS.
This includes different connectors and antennas that can be added to PCB models. If manufacturers purchase
connectors from a vendor, it's possible to obtain encrypted models from the vendor for use in PCB simulations.
