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Learn MoreAnsys Structures Product Line 2024 R1 Release Highlights
Taking advantage of technology advancements, the industry is moving toward Reliability Physics Analysis, or RPA, to predict electronic reliability more accurately; instead of trying to extract
While the RPA methodology does not require the use of FEA tools, Ansys Sherlock has been designed from the ground up to facilitate the performance of these exact types of calculations.
Ansys Sherlock is a powerful software tool for electronics reliability analysis. It helps engineers predict the reliability of electronic products by simulating various environmental and operational
Rand Simulation's FEA (structural) Consulting Engineer, Adam LeMay, will be presenting an introduction to Ansys Sherlock for electronics reliability for enhanced product designs via virtual testing (e
Ansys Sherlock Product Capabilities Sheet - Rand Simulation
Rand Simulation's FEA (Structural) Consulting Engineer, Adam LeMay, will be presenting an introduction to Ansys Sherlock for electronics reliability for enhanced product designs via simulation.
The Rand Simulation team will be available at our booth during the trade show and will be hosting two technical seminars discussing the use of Ansys simulation software for electronics reliability.
Ansys Electronics Reliability (ER) is a dedicated multi-physics, multi-tool solution that allows customers to test for the major causes of electronics failure (thermal, mechanical & electrical stress)
Product Line 2023 R2 Release Highlights - Structures
The latest Ansys Structures 2023 Product Highlights and Release Notes
Ansys Sherlock is a powerful physics-based electronics reliability design tool that enables engineers to predict the life of printed circuit boards (PCBs) & electronic assemblies accurately & quickly.
In 2023 R1, the Structures Product Line delivers new features and capabilities that allow our users to perform more accurate, efficient, and customizable simulation analyses.
Understand the performance and reliability impact of heat in electronics design, and how it can be mitigated through integration of Ansys Sherlock and IcePak.