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Key Feature 4 - Flagship Solver Connections
(AEDT Icepak + Mechanical)
Ansys Discovery enables seamless transfer of thermal,
pressure, and electronics cooling data to flagship
solvers for downstream validation and analysis.
• Transfer electronics cooling models including
geometry, materials and boundary conditions to
AEDT Icepak
• Transfer thermal and static pressure data from CHT
or thermal simulations to Ansys Mechanical
Benefits
• Allows upfront electronics cooling simulation in
Ansys Discovery with one-click transfer for final
validation in AEDT Icepak
• Improves flexibility and accuracy for thermal and
thermal-stress workflows in Ansys Mechanical
