Issue link: https://resources.randsim.com/i/1543882
©2026 ANSYS, Inc. 2 Ansys Discovery 2026 R1 Key Features Electronics Cooling with Joule Heating Feature name – CHT with Joule Heating Problem Solved: Electronics teams struggle to accurately account for electrical heat generation during early thermal performance evaluation. Industry: Electronics, High-Tech, Automotive, Industrial Equipment Ansys Product Workflow: Ansys Discovery → Enable Joule heating → Run CHT simulation → Validate in Icepak (if needed) Target Audience: Thermal engineers, electronics designers, system architects Feature name – Direct Connections to AEDT Icepak & Mechanical Problem Solved: Disconnected workflows make it hard to move from fast concept studies to high-fidelity validation. Industry: Industry Agnostic Ansys Product Workflow: Ansys Discovery → Ansys AEDT Icepak / Ansys Mechanical Target Audience: Simulation engineers, multiphysics users, validation teams Improved Fluids Meshing for Enhanced Accuracy Flagship Connections Feature name – Sharp Edge & Thin Feature Capture. Problem Solved: Fault tolerant meshing can miss sharp edges and thin regions forcing manual refinement and slowing early design iterations. Industry: Industry Agnostic Ansys Product Workflow: Ansys Discovery → Apply meshing → Run fluids/CHT simulation Target Audience: CFD users, design engineers running upfront fluid & CHT simulations