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©2026 ANSYS, Inc. 3 Ansys Discovery 2026 R1 CHT with Joule Heating • Combine electric conduction with conjugate heat transfer in a single simulation • Accurately capture heat sources for electronics cooling • Supports free and forced convection workflows Enhanced Fluid Meshing • Sharp edge capture improves resolution at inlets, outlets, thermal conditions and interfaces • Thin structure capture improves discretization of heat sink fins and narrow flow paths • Higher accuracy with fewer manual mesh controls Flagship Solver Connections • Direct transfer to AEDT Icepak for detailed electronics cooling validation • Transfer geometry, materials, and boundary conditions with one-click • Export thermal loads and fluid pressures to Ansys Mechanical Sensitivity Analysis & One-Click Optimization • Defined Variations now supports Sensitivity Analysis • Quantifies impact of input parameters on key outputs • Visualize trends using response surface plots • Improves early-stage design trade-off evaluation • Easily optimize designs with one-click optimization Fluid Virtual Walls • Define virtual walls between fluid regions without modeling thin solids • Supports perfectly conducting or perfectly insulating walls • Ideal for evaluating heat exchangers, radiators and other devices with thin baffles Ansys Discovery – What's New