Brochures

• HPC/Distributed Computing – in 2024 R1 there are further improvements to memory resource efficiency with new upgrades to the Distributed Matrix Assembly solver. HFSS supplements the inherent parallelization of its numerical solver computations with solvers dedicated to HPC. Distributed Computing support has been upgraded continuously over the last 15 years to offer the best simulation performance for complex designs of any offering in computational electromagnetics. • HFSS Finite Array metadata export and mask automation – Two new HFSS features extend Ansys dominance in 5G/6G antenna design. Mask automation automatically uses CSV files to create an array (a very handy capability for phased array antennas.) Metadata export allows you to export specific data from the array. This is especially important for post processing data in third-party tools. SIwave • The integration of SIwave with HFSS is being strengthened with the inclusion of near field simulation in HFSS 3D Layout. This greatly increases simulation speed at the system level. One of many applications which will benefit from this is EMI simulation for PCBs. Q3D Extractor • Improvements to Q3D solver - Distributed Memory solver for CG and a new AC RL solver for exceptionally large packages. EMA CHARGE Plus • Charge Plus has a new Adaptive Mesh to refine the mesh elements in regions that need more fidelity. In plasma simulation, this allows for more resolution near charged surfaces to capture physics such as plasma sheath formation. This advance will help in all aspects of plasma simulation, including Plasma-Enhanced Chemical Vapor Deposition analysis. • Charge Plus has added new Thermionic and E-field Emission Models for the emission of electrons from surfaces into plasma. In addition, there are new air breakdown models for gases other than air. These improvements allow for a complete solution for modeling arcing in electronic devices (electrostatic discharge), in high voltage switches, and in high voltage semiconductor processing equipment. • Charge Plus has a new Radiation Effects on Electronics Automated Workflow. Users can now automatically calculate dose-depth rates based on particle fluences specified in Ansys STK with a workflow that is automated and seamless between the two products. EMC Plus: • EMC Plus now has a GPU-Accelerated Solver that allows for dramatic performance improvements. The solver is the Finite-Difference Time Domain Full Wave solver, and the GPU speedup is applicable on a wide class of EMC Plus applications. • EMC Plus has new Cable Modeling Updates for electronics and full vehicles, including the ability to fuse wiring diagrams from cable database software with the three-dimensional routing of cables from mechanical CAD. In addition, new conductor cross-sections that are elliptical and rectangular are now possible for co-simulation. Finally, new mesh editing tools allow for surface and cable meshes to be adjusted by users to make complex, full device simulation even easier. • EMC Plus has added new Antenna Electromagnetic Interference (EMI) Simulation Features, including the calculation and visualization of antenna far-field patterns in three dimensions, the calculation of the Specific Absorption Rate (SAR) for human-body tissue, and the post-processing of EMI signals to match international standards.

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