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Electronics - Product Line 2024 R1 Release Highlights

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Thermal Integrity in AEDT Icepak • Introduction of Thermal Mesh Fusion [Beta] – Thermal Mesh fusion enables automated partitioning of the target geometry into subdomains of similarity and then applies the most appropriate mesher to the subdomain. These are then re-combined enabling a robust and automated mesh ideal for engineers working with complex CAD. • Introduction of the use of Fluent's GPU solver for Icepak [Beta] – thru the enablement of Fluent's GPU solver, Icepak can now employ multiple GPUs to accelerate simulation in HPC/Distributed Computing environments by up to 70x. Mechanical Thermal • Introduction of the Transient Thermal Solver – Enhancing the well-received utilization of steady state thermal is our introduction of a Transient Thermal solver in AEDT Mechanical. This solver enables transient boundaries and excitations readily. This innovative technology also utilizes Ansys' flagship HFSS meshing technology and the Ansys Mechanical solver. • Introduction of Thermal & Structural Layout Components with Trace Mapping – includes variable geometries per PCB layer and a metal fraction map like what is in Icepak.

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