Brochures

• High Fidelity Efficiency Mapping – More accurate and more robust analysis of efficiency mapping in the design and validation stages. It can be coupled to Maxwell and is HPC compatible. • Solver Speed Enhancement – The multi-threading model has been improved to increase speed and efficient use of multiple cores. The speed of the thermal transient calculation is twice as fast as that of the previous release (2023 R2). • NVH Structural Model Tuning – You can now tune the modal stiffness, natural frequency, and damping ratio for NVH prediction analysis. By tuning with 3D mechanical analysis or test data, you can enhance accuracy, while maintaining speed for design and operating space exploration. Moreover, you can improve your understanding of the impact of the motor NVH behavior by launching Ansys Sound directly on the acoustic plot. Ansys Maxwell The low frequency team has further fine-tuned the ECAD integration into Maxwell from the previous release (2023 R2) to enable for the very first-time simulations on Flex PCBs. The Shell Element and Nonlinear Resistive Thin Layer modeling have been introduced to enhance accuracy and reduce further the simulation time on EM designs for which the geometries exhibit high aspect ratios and demand greater accuracies. • ECAD Integration Enhancements – The Phi-Plus Mesh feature enables low frequency EM simulations for ECAD and MCAD assemblies with parallel meshing over multiple domains, resulting in a 10-fold decrease in simulation time. This provides superior design robustness to rigid and flex PCBs, combined with an improved design predictability by increasing accuracy on the ECAD-MCAD assemblies. Time-to-market is shrunk since the virtual prototyping design iterations are reduced. • Shell Element Modeling – Shell elements are used in FEA to accurately analyze EM effects in thin structures and components. The modeling reduces the total computation time and improves accuracy of the EM field computation on magnetic shielding and EMI/EMC. In addition, it provides increased accuracy in the analysis of thermal and EM coupling on EM heating and in the analysis of coil windings and inductors with thin conductive layers. • Nonlinear Resistive Thin Layer Modeling (NRTM) – This type of resistive modeling is used to model materials or interfaces with nonlinear resistive behavior. In EM simulations, resistive boundaries are often used to represent materials that exhibit nonlinear conductivity. You can now obtain the nonlinear resistive behavior using the electric conductivity and current density. The NRTM increases simulation reliability in power electronic applications and reduces total computation time, while increasing the accuracy of EM simulations. Moreover, for switch gears applications, the accuracy of the electric arc workflow simulation is improved by developing a nonlinear think layer model. HIGH FREQUENCY RELEASE HIGHLIGHTS HFSS • IC Mode in HFSS 3D Layout now includes support for encrypted technology files. HFSS can import encrypted technology files -and use them in simulation within 3D Layout. Additionally, there are enhancements to Rigid Flow and further IC Mode improvements. • Flex PCB support is now included in HFSS 3D through the use of Layout Components. A Flex PCB layout in HFSS 3D Layout can now be imported into HFSS 3D to assemble a full system and run simulations in a streamlined workflow. This further enhances HFSS support for Flex PCB, a unique advantage Ansys offers over competitors – Flex PCB HFSS is a cutting-edge space for PCBs, and no competitor offering can effectively manage the SI/PI/EMI challenges posed by bending fully flexible or semi-rigid PCBs in three dimensions.

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