Issue link: https://resources.randsim.com/i/1510288
• Comprehensive reference data: Reliable and statistically validated information on a wide variety of material grades and forms • Visualization: Quickly identify trade-offs between competing property requirements (cost, mechanical, thermal, environmental) • Improved time to market – Designers identify candidates for "alternative" materials up to 2X faster • Reduced carbon footprint by 10% while maintaining mechanical properties sufficient for design • Reduce the carbon footprint of materials used in packaging for electronic components Designing More Sustainable Packaging • Understand the influence of fillers on CO2 footprint and impact strength • Supplier's suggested material (PHA) is not viable as it exhibits low toughness • Possibility of 10% reduction in CO2 footprint by increasing CaCO3 Customer Challenge Outcome Solution 26