Issue link: https://resources.randsim.com/i/1543877
©2026 ANSYS, Inc. 6 Key Feature 3 – 3D Power Integrity in HFSS & HFSS-IC HFSS-PI Industry's Only High-Capacity, 3D EM Solver for PI Analysis What's new: The new HFSS-PI technology in HFSS and HFSS-IC: • Designed for the next-generation chip-package power delivery challenges, addressing tighter integration, higher density layouts, and complex 3D packaging (InFO, CoWoS, WoW, COUPE) • Broadband 3D Power Integrity (PI) solver - DC to higher frequencies • Built on the NexGen HFSS Mesh & Solve (Prism) technology for high- capacity, high-performance simulation • Comprehensive IC/Package workflows • Advanced geometry pre-processing Advantages: • Accurate 3D EM analysis, enabling reliable end-to-end PDN modelling across dies, packages, & boards • High capacity & performance Prism mesher for complex designs, e.g. massive multi-layer PDNs • Accurate broadband behaviour (DC to High-Freq) within a single consistent solver • Deep insights into complex coupling mechanisms and return paths analysis, which are difficult to capture using reduced-order or 2.5D tools from competitors SHORT PITCH A broadband 3D Power Integrity simulation with the speed, capacity, and accuracy required to meet the challenges of power delivery for IC, Package and Board designs