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HF Electronics 2026 R1

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©2026 ANSYS, Inc. 9 Feature 6: Component 2.0 [Beta] What's new: the new Component 2.0 • A new ".acmp2" component file type • Create a unified component containing multiphysics representations compatible with HFSS, Icepak STM, Icepak Detailed, Q3D • Define a component once at the project level and reuse it across all designs • Full encryption support, equivalent to existing a3dcomps Advantages: • One component, many solves consistent EM, thermal, and conduction behaviour across the workflow • No duplicate model creation faster setup and reduced risk of mismatched component definitions • Streamlined multiphysics workflows simplifies HFSS/Icepak/Q3D flows with aligned geometry/material definitions HFSS Icepak STM Icepak Detailed Q3D

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