Issue link: https://resources.randsim.com/i/1543877
©2026 ANSYS, Inc. 3 Ansys HF Electronics 2026 R1 GPU Acceleration using cuDSS [Beta] HFSS now supports GPU acceleration using cuDSS, enabling up to 1.6X faster frequency sweeps. Multi- nod distribution is also supported. HFSS-PI for 3D Power Integrity HFSS-PI is a new broadband 3D Power Integrity simulation capability with the speed, capacity, and accuracy required to meet the challenges of power delivery for IC, Package and Board designs. It is now available in HFSS and HFSS-IC products. Layout Component support in Q3D Q3D MCAD now supports Layout Components in 3D Layout workflows, significantly improving usability. Omega Mesher for Rigid-Flex PCBs A new OMEGA Mesher in HFSS 3D Layout, specifically optimized for reliable meshing of complex bent rigid-flex PCB layouts. SIwave Performance Improvement Major performance upgrades to the SIwave DCIR and the XYZ solver, resulting in 4X-10X faster simulation times. Component 2.0 [Beta] A new unified component file type containing multiphysics representations across HFSS, Icepak, and Q3D, enabling improved usability & streamlined multiphysics workflows all via one component file. Ansys HF Electronics – What's New