Issue link: https://resources.randsim.com/i/1543877
©2026 ANSYS, Inc. 2 Ansys HF Electronics 2026 R1 Key Features GPU Acceleration with cuDSS [Beta] Feature name –GPU acceleration using cuDSS Problem Solved: Slow EM solves for large designs, long sweep runtimes Industry: All Ansys Product Workflow: HFSS Target Audience: HFSS power users, RF engineers Feature name – HFSS-PI for 3D Power Integrity Problem Solved: Inaccurate modelling, limited solve capacity, and missing 3D effects when modelling 3DIC packages Industry: FA&D, High Tech, Space, Industrial Healthcare, Automotive Ansys Product Workflow: HFSS-IC Target Audience: advanced packaging PI teams, electronics system architects Reliably Mesh the Impossible Achieve True 3D Power Integrity at Scale Feature name – Omega Mesher for Rigid-Flex PCBs Problem Solved: Meshing failures on curved/bent boards, high RAM use, slow initial mesh Industry: FA&D, High Tech, Space, Automotive, Healthcare, Industrial Ansys Product Workflow: HFSS Target Audience: Rigid-Flex PCB designers, SI/PI/EM engineers