Issue link: https://resources.randsim.com/i/1534807
OVERVIEW Ansys Electronics continues to demonstrate its leadership in computational electromagnetics, supporting cutting-edge product development across diverse markets and applications. The 2025 R1 is delivering enhanced simulation performance, meshing, pairing with other Ansys software products, and automated workflows capabilities to further solidify Ansys' position in the multiphysics design and simulation of RF electronics, PCBs, assemblies, electric motors, and electronic devices. This includes leading applications in: o Electric machines o Consumer electronics devices o Power electronics o Chip-to-Systems & 3D-IC o Wireless Communications, antennas & radars The 2025 R1 includes the following key new product features and capabilities; ✓ New single design workflow for DC biased frequency domain analysis (Maxwell) ✓ New axial flux machine template (Motor-CAD) ✓ Higher accuracy with Continuum Air plus Skew Model for electric machines (Maxwell) ✓ Enhanced Mesh Fusion (HFSS & HFSS 3D Layout) and Multi-Node distribution (HFSS-IC) ✓ Complex Value Support for R/L in Edit Sources (Q3D) ✓ PI Advisor Enhancements (SIwave) ✓ Electronics AI+ (AEDT) RELEASE HIGHLIGHTS The Tables below summarize the major new features and capabilities for each of the 13 products in the Electronics product collection. Some of the products (especially low frequency) are grouped together by applications. Note that the Ansys Icepak/AEDT products (namely Electrothermal solutions) are the Electronics Business Priority in 2025 and, therefore, a focus in the product marketing activities. Ansys Electronics 2025 R1 Highlights