Issue link: https://resources.randsim.com/i/1515867
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 61 / PHOTONICS CHARGE CML Compliler DGTD FDTD FEEM HEAT INTER- CONNECT qINTER- CONNECT MODE MQW STACK RCWA Verilog-A Platform DESIGN ENVIRONMENT Finite Element IDE (with 2D/3D modeling) • • • • Finite Difference IDE (with 2D/3D modeling) • • • • Hierarchical Schematic Editor • • GENERAL HPC-ready / compatible with cloud providers • • PIC Element Library • Supports CML development and distribution • • Automated CML generation • Version controlled CMLs • Structured input with template and data validation • Automated test case generation • IP protected CMLs • • INTERCONNECT and Verilog-A models from single source • • • Leverage build-in analysis from 3rd party EDA tools • Design and model using Verilog-A in 3rd party EDA tools • Available in Ansys Cloud • • • • • • • • • • • • Ansys Cloud HPC Services Integration • • • • • • • • • GENERAL SOLVER CAPABILITIES Charge transport (electrostatic potential and drift diffusion) • Self-consistent heat/charge modeling • • Heat transport (heat flux, convention, and radiation) • Finite Element Eigenmode Solver • • Discontinuous Galerkin Time Domain Solver • Finite Difference Time Domain solver • Finite Difference Eigenmode solver • • Bidirectional eigenmode expansion • 2.5D variational FDTD (varFDTD) • Advanced Finite Difference Conformal Meshing • • ▲