Issue link: https://resources.randsim.com/i/1515867
• Full Support ▲ Limited Capability ▪ Requires more than 1 product 60 / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable EMA3D Charge Nuhertz FilterSolutions Electronics Pro Electronics Enterprise MULTIPHYSICS-PLATFORM TECHNOLOGIES Advanced, Automated Data Exchange • • • • • • • Drag-n-Drop Multiphysics ▪ ▪ ▪ ▪ ▪ ▪ • Direct Coupling Between Physics • • • • • • • Collaborative Workflows • • • • • • • Fully Managed Co-Simulation • • • • • • • Flexible Solver Coupling Options • • • • • • • MULTIPHYSICS ELECTRO-THERMAL INTERACTION Convection Cooled Electronics ▪ ▪ ▪ ▪ • Conduction Cooled Electronics ▪ ▪ ▪ ▪ • High Frequency Thermal Management ▪ ▪ ▪ • Low Frequency Thermal Management ▪ ▪ ▪ • MATERIALS FOR ELECTRONICS Granta Materials Data for Simulation ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ Granta MI Materials Gateway ▪ ▪ ▪ ▪ ▪ ▪ ▪ Ansys Granta Advanced Materials – Electromagnetic ▪ ▪ ▪ ▪ ▪ ▲ ▪ MISCELLANEOUS Integrated Windows HPC Support • • • • • Integrated IBM Spectrum LSF Support • • • • • Customizable 3rd Party Scheduler Support • • • • • Support ACT Extensions ▲ ▲ ▲ ▲ ▲ ▲ Parallel Solving with Ansys Cloud Launched from Desktop • • • • • Elastic Licensing • • • • • • CHARGING AND DISCHARGING MODELING Internal Charging • Electrostatic Discharge in Air • Surface Charging • 3D Particle Transport • Arcing in Solid Dielectrics • Coupled Charging Simulations •