Issue link: https://resources.randsim.com/i/1504835
Ansys Electronics Reliability Overview // 1 PRODUCT MATRIX Ansys Products Ansys SpaceClaim Ansys Mechanical/ Ansys LS-DYNA Ansys Sherlock Ansys Icepak Ansys SIwave, HFSS Ansys GRANTA Ansys Minerva Ansys optiSLang Ansys Twin Builder Capability Applications Electrical Reliability Signal Integrity, Power Integrity, EMI Simulations ● DCIR Simulations ● Thermal Reliability Steady-State and Transient Thermal Analyses ● ● Fluid-Flow and Conjugate-Heat Transfer ● Mechanical Reliability Geometry Modeling, Meshing ● ● ● Static analyses, Thermal analyses, Shock and Vibration ● ● Impact and Drop Test ● Reliability Physics Analysis ECAD to MCAD Conversion, MCAE Mesh creation, Material Mapping ● ● DFMEA analyses, Physics of Failure Mechanisms ● 2D, 3D, Histograms, Contours, Scores ● Comprehensive Multiphysics Multiphysics Analysis Support ● ● ● ● ● ● ● Optimization Studies, Process and Data Management ● ● Materials Selection and Materials Intelligence ● Systems-Level Modeling and Simulation ● Ansys Electronics Reliability Overview Minimize EMI/EMC Risk Meet or Exceed Power/Signal Integrity Goals Withstand severe shock/drop/vibe events ELECTRONICS Ansys Electronics Reliability solutions help engineers address critical electrical, thermal and mechanical challenges early and throughout the product design process. Utilizing an integrated product workflow featuring Ansys HFSS, Icepak, LS-DYNA, Mechanical, SIwave and Sherlock, engineers can ensure the reliability of their electronics systems before prototype. Using our integrated product workflow, engineers can predict EMI and EMC issues, solder joint fatigue failures, random and harmonic vibration concerns, at-risk components during shock, drop and thermal cycling and much more. Learn more about Ansys products at: www.ansys.com/products