Ansys Electronics Reliability Overview //
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PART & MATERIAL
INFORMATION
Using Ansys Sherlock, users can leverage an embedded parts library that contains
over 500,000 parts to create accurate models for meshing and simulation. Further,
Ansys Sherlock and Granta libraries contain a wide range of materials data, as well
as selection and data management tools that allow users to explore the range of
materials solutions available for their product designs.
CAPABILITIES
POWERFUL SIMULATION
PRE-PROCESSING
Ansys tools provide a broad range of pre-processing solutions, including geometry
extraction from ECAD layouts, powerful geometry defeaturing and meshing tools,
as well as the ability to model PCBs and package substrates using a suite of class-
leading techniques, such as trace mapping, reinforcements and trace modeling.
Additionally, the Ansys EDB format allows for a single ECAD file format across a variety
of simulation workflows.
ELECTRICAL RELIABILITY Using Ansys HFSS and SIwave, users can assess signal integrity, power integrity,
electromagnetic interference, EMI, EMC, ESD, EOS and electromigration risks.
THERMAL RELIABILITY Ansys Icepak uses precise geometries and electrical inputs to accurately predict
temperature rise and assess the merits of different cooling strategies.
MECHANICAL RELIABILITY Ansys Mechanical and Sherlock simulate single or repeated mechanical events such
as vibration, shock, thermal cycling and static loading to determine potential product
failure risks.
PREDICTING TIME TO
FAILURE
Using the Physics of Failure (PoF) approach, Ansys Sherlock determines how long
before a product fails and why it failed.
S I W A V E
I C E P A K
Ansys SHERLOCK
PRE-PROCESSING
ANSYS, Inc.
www.ansys.com
ansysinfo@ansys.com
866.267.9724
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