4 A Workflow Combining Ansys Sherlock, Icepak, and Mechanical to Evaluate the Reliability of Electronic Systems
7. The resulting thermal maps can be imported back into Sherlock to quantify the solder fatigue failure risk associated with power
cycling. The profile here assumes one power cycle per day, resulting in one large temperature swing.
8. The Sherlock analysis shows a solder fatigue risk resulting from the temperature swings when the board heats up and cools
down during daily power cycling:
Figure 8: Sherlock Thermal Cycle.
All Component Pass Natural Convection without DCIR
Some Components Fail Natural Convection with DCIR
