3 A Workflow Combining Ansys Sherlock, Icepak, and Mechanical to Evaluate the Reliability of Electronic Systems
Figure 5: HFSS Computed DCIR Losses.
Figure 6: Natural Convection Icepak Thermal Gradient Results.
Figure 7: Natural Convection Icepak Thermal Gradient Results.
6. These losses are then mapped as heat loads in Ansys Icepak and coupled to the thermal solution to more accurately calculate
board temperature gradients for both the forced and natural convection conditions. Thermal and PCBA reliability results with
and without the inclusion of the HFSS DCIR analysis are presented here to show their potential significance.
As shown in the results below, the DCIR losses are due to current crowding, which can increase hotspot temperatures on the PCB:
