Brochures

Ansys EMC Plus (formerly Ansys EMA3D Cable) • Automatic Printed Circuit Board (PCB) Import – EMC Plus can import PCB files from the Ansys Electronics Database (EDB) format, automatically assign linear components including resistors, capacitors, and inductors, and also automatically assign electromagnetic material properties. In short, the mesh can be adapted to geometric requirements. • Variable Grid Mesh Engine – EMC Plus has a new variable grid mesh engine that allows for smaller mesh sizes in some locations to resolve tiny features and larger mesh sizes in areas without such features to allow for faster computation. • Radiation Pattern Calculation – EMC Plus can now calculate the far-field antenna radiation pattern while keeping the simulation domain close to the edge of the antenna. This ensures antennas and RF systems are properly modeled as part of a larger EMC simulation. Ansys Charge Plus (formerly Ansys EMA3D Charge) • Mesh Engine Updates – the native Discovery mesh engine has been added to Charge Plus, tightening our integration and partnership with Ansys Discovery, and improving our meshing speed and stability when using the time domain FEM solver for a more optimized user experience. The FDTD solver in Charge Plus (which is the same solver as the FDTD one in EMC Plus) has also been updated - it has a new variable grid mesh feature that allows for smaller mesh sizes in some locations to resolve tiny features and larger mesh sizes in areas without such features to allow for faster computation. • Advanced Plasma and Gas Flow Modeling – Compressible fluid dynamics is coupled to the existing electrodynamic and PIC solvers in Charge Plus to create an advanced simulation tool for plasma and gas flow modeling in applications such as plasma-enhanced chemical vapor deposition and etching. • Integration with Ansys Chemkin-Pro – Ionized gas and surface reactions are now captured in Charge Plus by coupling Chemkin-Pro to the PIC and the CFD solvers, providing a streamlined approach to simulating the complex chemical reactions involved in plasma-assisted processes. Ansys SIWave & Ansys Q3D Extractor • SIwave – new electrothermal flow, DC power tree improvements and thermal-aware package model extraction a. New electrothermal flow for power electronics - includes frequency-dependent sources b. DC power tree export enhancements – adds distributed voltage probes and aggregate voltage drop in power tree c. CPA Thermal aware package model extraction – temperature-dependent materials are supported in all CPA solvers and RLCG results can be plotted now as a function of temperature • Q3D – new electrothermal flow, scalable AC-RL solver for large packages and improvements to distributed memory capacitance extraction solver a. New electrothermal flow for power electronics - includes frequency dependent sources along with harmonic loss calculation based on frequency-dependent resistance (Rf) b. Scalable AC-RL solver for very large packages - utilizes MLFMM for very large problems and enables multi-threading for pre-processing c. Improvements to distributed memory capacitance extraction solver - MPI-FMM now supports all CG- solver functionalities

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