Issue link: https://resources.randsim.com/i/1504452
OVERVIEW In the Ansys 2023R2 release, Ansys Electronics continues to demonstrate its Technology leadership in computational electromagnetics. Improvements in simulation performance, meshing, integrations with other Ansys tools, automated workflows and modeling capabilities extend Ansys leadership in electromagnetic simulation and computational multiphysics for combined chip-package-PCB simulation, electric machines, consumer electronics devices, HPC, 5G/6G and other high performance RF antennae and systems, automotive electronics and many other computing, consumer, military and aerospace applications. RELEASE HIGHLIGHTS Ansys HFSS • Integrations of Q3D and Raptor-X with HFSS 3D Layout – a complete electromagnetic simulation and modeling solution for IC design. This permits HFSS 3D Layout to combine the electromagnetic capture of a full chip design with Q3D RLCG parasitics at both the package and board level in order to execute a full chip to system EM simulation. There are also future implications to 3D-IC. • 3D component array with platform geometries – improvements to simulation of antennas on or in a larger structure such as an airframe or cell tower, further reinforcing the HFSS reputation of being able to execute EM simulations over scale with gold standard accuracy. • HPC scalable distributed adaptive refinement (Beta) – further increase in simulation performance thru efficient utilization of distributed computing resources. Ansys Thermal Integrity (Icepak and Mechanical Thermal) • Icepak – Solver & Meshing Enhancements a. Joule Heating enhanced meshing & convergence – can be accessed as well in AEDT as Boundary-Based Mesh Refinement b. Major improvements to Solver Performance – up to 5.3x compared to Classic Icepak and up to 11.4x compared to AEDT Icepak in 23R1 release • Mechanical Thermal - Beta releases for Thermal Transient Solver and ECAD Modeling Component Layout a. Thermal Transient Solver – links to Q3D, Maxwell and HFSS for transient electrothermal simulations, including boundaries and excitations b. ECAD Modeling – EDB file import and trace mapping, 3D layer support, common file format with Maxwell and HFSS Electronics Product Line 2023 R2 Update