Brochures

• Enhancements have been made to the Sherlock-Workbench/Mechanical workflow to help streamline the reliability assessments of electronic assemblies with multiple printed circuit boards (PCBs). Users can now perform module- and product-level reliability assessments without having to manually import results from multiple boards back into Sherlock. • The Sherlock-AEDT Icepak workflow has been enhanced to facilitate import of temperature results from multiple PCBs into Sherlock. The improved usability of this workflow allows users to rapidly import temperature data to perform solder fatigue assessments in Sherlock using accurate thermal data from AEDT Icepak simulations. Further, updated export options form Sherlock to AEDT Icepak (such as the ability to export arcs and segments, as well as input and export thermal resistances that can be used with 2R compact thermal models) allow users to create more accurate and efficient PCB models for thermal analyses. • Ansys Sherlock can now perform thermal conduction analyses as part of the Thermal-Mech workflow (including support for part temperature rise, thermal CSV and thermal image mapping). Thermal conduction support allows users to consider more accurate temperature distributions in PCBs when performing thermal-mechanical assessments in Sherlock. • New Sherlock Automation APIs support the automation of ICT analyses, including the ability to create, edit, and export test points and text fixtures. Such automation will allow users to rapidly address the reliability impacts of different static loading conditions. Users can go further by performing sensitivity studies involving ICT analyses using Sherlock and optiSLang. Ansys Motion • Increased commonalities between the Motion interface in Mechanical and the Mechanical interface ensure that end users are operating from a similar UX for ease of use. New updates to the Motion ACT include improved joint consistency, flexible edge contacts & co-simulation possibilities with FTire. • New functionalities within the Motion stand-alone post-processor include pre-set window properties, multi-axis charts, independent contact pressure and stress/strain plots for multi-layered elements. This allows users to post-process their models more easily and in a more automated manner. • Improved Motion stand-alone solver performance includes enhancements to constraint formulations and electromagnetic force data handling that speeds up simulation times by 3X. Solution accuracy improvements to the eigenvalue solver mean models can now be more accurately solved the first time around. Ansys Sound • A new feature available within the SAS (Sound Analysis & Specification) module allows users to assess vibration data as well as acoustic data. Converting vibration data to velocity data to displacement data and vice-versa into signal, spectrum and spectogram allows users to make the link between vibration data and acoustics. • Within the VRS (Virtual Reality Sound) module, multiple 3D soundtracks can now be played on multiple loudspeaker systems, including an equalizer feature to tune the sound rendering according to the environment/rooms the loudspeakers are in. • In the ASDforEV (Active Sound Design for Electric Vehicles) module, a new granular sound synthesis technique offers infinite ways to generate interactive sounds controlled in real-time by CAN-Bus driving parameters.

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