Issue link: https://resources.randsim.com/i/1492204
available process simulations through guided workflows and material models for Metal Binder Jet Sintering. • Accuracy enhancements include the ability to include Laser Power Bed Fusion (LPBF) scan pattern effects in Workbench Additive. With the consolidation of additive technologies, users now can rapidly increase the fidelity of simulation, capturing localized strain variations in each deposition layer. Scan pattern variations are particularly important in thin wall structures and rapidly repeating laser exposure strategies. • Introducing a Machine Learning (ML) model for predicting thermal strain that can result in 10X time savings. Users can now easily explore the benefits of varying process setup parameters such as power, speed, and scan vector hatching by accessing the full fidelity of capturing process parameter and scan orientation effects without consuming compute resources for long periods of time. Ansys LS-DYNA • Improvements to Incompressible Smooth Particle Hydrodynamics (ISPH) includes: a new utility tool to process SpaceClaim data, better visualization, ability to record time history of FSI forces, removal of volume constrained resources (e.g., gearbox analysis), heat transfer coefficient (HTC) calculation for import to Mechanical and Fluent for thermal analysis, and SPH box fragmentation. • Comprehensive battery safety workflow to simulate thermal runaway following thermal and mechanical abuse. Predict the combined structural, electrical, electrochemical, and thermal (EET) responses of automotive batteries – validated through experiments. • Series of HPC and performance enhancements, including ONE MPI packaging that helps customers confidently migrate their workflows from Platform MPI to Intel or Open MPI with ease and boundary element method (BEM) acoustics performance improvements. Improved multithreading in R14: up to 2x faster vs. R13. New version of variational BEM with fast low-rank matrix assembly, reducing simulation time from days to hours. • With significant improvements to Meshing quality and the support for Multi-case modelling in Workbench, LS-DYNA users can now easily perform drop and impact analysis for multiple cases with a single model setup, allowing for quicker results to review and compare. • Solder reflow simulation, multiscale modelling, and Sherlock to LS-DYNA workflow as new capabilities for High-tech electronics. • Patent pending technology, multi-scale co-simulation, introduces a way for users to include meso-scale effects from joints with macro-scale structures to analyze the global structural response and simultaneously capture failure responses at meso-scale without compromising accuracy. Ansys Forming • Newly released clamping simulation features. Features include: realistic clamping and gravity, easy and intuitive definition of clamps, closing of clamps sequentially, import of reference geometry for deviation analysis and accurate springback analysis. • Perform analysis of contact distance and contact pressure • Improved creation and editing of curves for setup and analysis • Improved job manager, with added support for: Windows MPP Solver, LS-DYNA start on Linux compute server, LS-DYNA start on HPC. Ansys Sherlock / Electronics Reliability Solutions