Issue link: https://resources.randsim.com/i/1492196
OVERVIEW In the Ansys 2023 R1 release, Ansys Electronics continues to demonstrate its Technology leadership in computational electromagnetics. Improvements in simulation performance, meshing, integrations with other Ansys tools, automated workflows and modeling capabilities extend Ansys leadership in electromagnetic simulation and computational multiphysics for designing high speed PCBs, electric machines, antennae, radar and other electronic systems. RELEASE HIGHLIGHTS Ansys HFSS • Layout Component Placement Enhancement in HFSS 3D – Improved workflow to easily place Layout components in HFSS 3D to create extremely complex assemblies in a few minutes. • HFSS Parallel Component Adapt for 3D Component Array – Accelerate finite array simulations by adapting individual 3D component cells of an array in parallel. • Improved HPC performance for distributed mesh fusion solver – Improves hardware utilization and simulation time when mesh fusion is used. Ansys Icepak w/AEDT • New Meshing Enhancements – stair step meshing (2D multilevel) that captures individual layers and details, resulting in a more robust PCB meshing which functions on both stacked and layered structures. The enhancement is also incorporated into the sliding bar mesh. • Enhanced post processing for thermal fields resulting in a 2-3X speedup in performance over the 22R2 version. • Compact Thermal Model (CTM) Version 2 support. This enables code simulation bidirectionally with Redhawk-SC ET when utilizing encrypted TSMC technology. By using Ansys Icepak, users can capture environmental effects (fans/airflow and convection/radiation) and then return this thermal data to RHSC-ET. Ansys Maxwell • Induction Machine ROM-based Efficiency Map – by utilizing Reduced Order Modeling (ROM) and including it in the electric machine toolkit, a FEA solution is effectively squeezed down to a circuit simulation, providing a significant simulation performance enhancement. • Performance improvements for quasi-static solvers - this set of enhancements is particularly helpful in PCB simulations where the conduction path includes complex geometry (which inevitably results in a large number of excitations.) In applications such as portable devices, computers, switch mode power supply devices, etc., where multi-layer PCBs allow for much higher component density, fine conductive traces are needed. Enhancements to the quasi-static solvers reduces the CPU time assignment of the magnetic field, with processing that occurs at the beginning of solution reduced from hours to minutes. Electronics Product Line 2023 R1 Update