Ansys Icepak® for ELECTROTHERMAL MANAGEMENT (Electronics Business Priority
in 2025)
The electronics cooling simulation software is adding new capabilities in this release to reach out to more users
(Electric Engineers, Mechanical Engineers, Thermal Engineers, and Semiconductor/Chip Level Thermal
Engineers), including:
ENHANCING USER EXPERIENCE & WORKFLOW
FEATURES / CAPABILITIES BENEFITS / VALUES VISUAL
TZR Import Greatly Enhanced to
Enable Order-of-Magnitude
Improvements in Import Times:
• Geometry
• Mesh
• Most boundary conditions/heatsink
Time saver (faster import of
models into AEDT) &
improves UX
Mechanical & Icepak import into
Ansys Workbench
• Both solutions can be imported into
Workbench from AEDT
o Geometry & Materials
o Temperature Passing
Enables multiphysics links
between AEDT and
Workbench for integrated
workflow and advanced
Mechanical Analysis
3D-IC Multi-Die Thermal Model
• Chip-Package-System model to
perform system thermal analysis
• Assembly information linked from
RHSC-ET
• End-to-End Encryption
Enables Chip-Aware Systems
thermal analysis readily with
accurate ROM of the 3D IC in
RHSC-ET
Others: Mesh Links to Solved Setup |
Network Editor-PyAEDT Enabled
Enhancements | Zoom in Modeling
Toolkit, Mesh Fusion Enhancement
and more.
Increased Accuracy & Time
Saver!
