Issue link: https://resources.randsim.com/i/1534798
OVERVIEW The 2025 R1 release of Ansys Discovery introduces powerful new features that enhance the entire design exploration and simulation workflow, enabling users to streamline model preparation, increase confidence in simulation results, and accelerate design space exploration. Model preparation for simulation is more efficient with the ability to detect swept meshing feasibility and an improved workflow for creating and organizing beams and shells. Have confidence in simulation results with major enhancements for thermal management simulations, especially in applications like electronics cooling and heat exchangers, through powerful GPU-based meshing with automated local sizing controls and DC electric conduction to evaluate voltage drop, current density, and Joule heating across various components. Push the boundaries of design exploration even further with the ability to solve thousands of simulations in minutes by sending, or 'bursting', to the cloud to understand design limits and tradeoffs, calculate response curves, perform sensitivity studies, and optimize models for peak performance. RELEASE HIGHLIGHTS Ansys Discovery Accurate Thermal Management Simulation Thermal management simulations, such as those for electronics cooling and heat exchangers, are inherently complex and challenging to model efficiently. Discovery continues to enhance its capabilities to streamline and accelerate the entire simulation workflow, enabling more accurate simulation-driven design. Additionally, models can be seamlessly transferred to Ansys Icepak or Fluent for more detailed, in-depth simulations. New features include • GPU Meshing – The new fault-tolerant GPU-based automated meshing significantly reduces memory requirements and accelerates the generation of highly accurate conformal meshes for complex, dirty geometries. Local fidelity controls automatically refine the mesh in critical areas and smaller features while maintaining smooth transitions between cell sizes to improve simulation accuracy. • DC Electric Conduction – Improve electrical component designs with new electromagnetic capabilities that enable simulation of DC electric conduction. Accurately evaluate voltage drop, current density, and Joule heating across various components, including busbars, fuses, conductors, and more. • Internal Fan Model – Explore a larger variety of electronic component cooling designs with expanded capability to model 3D fans inside of the fluid domain. • Faceted Geometry Conjugate Heat Transfer – Simulating highly complex heat exchanger designs, such as high-efficiency gyroids, is now achievable through advancements in GPU-based automated meshing and a new capability to simulate conjugate heat transfer (CHT) of faceted geometries. Overcoming previous barriers, enabling the generation of high-quality meshes and solving models within practical timeframes. Efficient Model Preparation for Simulation Discovery's modeling capabilities continue to grow more powerful, enabling users to efficiently prepare and better understand their geometry. Each release introduces new and improved features to ensure a seamless transition from Ansys SpaceClaim, including: • Sweep Meshing Feasibility – Analyze specified bodies of a model to determine if they can be meshed using a Ansys 3D Design 2025 R1 Highlights