Brochures

2023 R2 Capabilities Chart

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• Full Support ▲ Limited Capability ▪ Requires more than 1 product 63 / PHOTONICS CHARGE CML Compliler DGTD FDTD FEEM HEAT INTER- CONNECT qINTER- CONNECT MODE MQW STACK RCWA Verilog-A Platform POSTPROCESSING Q-Factor Analysis • • Charge Generation Rate • • Bend Loss Analysis • Overlap analysis • Model area analysis • Helical waveguides • Extract gain/absorption and spontaneous emission coefficients for TWLM model (INTERCONNECT) • Statistical support (Monte-Carlo Analysis) • • • • • • • Statistical Support (Corner analysis) • Small-signal analysis • Steady-state and transient analysis • • Laser Self-Heating • TOOL INTEROPERABILITY Multiphysics Solver Interoperabilty • • • • • • Automation API (Lumerical script/Matlab/Python) • • • • • • • • • • Circuit electronic photonic co-simulation (3rd party tools) • • optiSLang Integration • • • • • • • • • • Shared workflows with Speos • • • Speos Surface Models: BSDF/BRDF format exchange • Speos Surface Models: Diffraction Grating SOP Plugin • • • Optics Interoperability Workflows with Speos and/or Zemax • • • Process Enabled Photonic Component Design Workflows • • • • • • Virtuoso layout integration • • KLayout integration • FLUIDS Inlet and Outlet Conditions • Steady-state Flow •

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