•
Full Support
▲
Limited Capability
▪
Requires more than 1 product
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/ ELECTRONICS
Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable
EMA3D
Charge
Nuhertz
FilterSolutions
Electronics
Pro
Electronics
Enterprise
ELECTRONICS COOLING
Network Modeling
▪ ▪ ▪ ▪ • •
Joule Heating Analysis
• •
Thermo-Electric Cooler Modeling
• •
Thermostat Modeling
• •
Package Characterization
• •
CABLE MODELING
Finite Difference Time Domain Analysis
•
Multi-Conductor Transmission Line Analysis
• • • • • • • •
Two-Way Coupling FDTD and Transmission Line Solver
▲ • ▲
Twisted Conductors
•
Seam Impedance
•
Cable Junctions
•
Braided Shield Support
•
Pin Voltage, Current Density, Plane Wave Excitations
•
Multi-Conductor and Multi-Shield Support
• •
Uses SpaceClaim Design Modeler UI
•
Thin Surface and Thin Wire Algorithms
•
HPC FOR ELECTRONICS
GPU Support
• • • •
HPC Meshing, Multi-Domain, Multi-Technology
• •
HPC Accelerated Frequency Sweeps
• • • •
HPC Accelerated Broadband Fast Frequency Sweep
• •
HPC Distributed Hybrid Solving
• •
HPC Enabled Domain Decomposition Method
• • •
HPC Time Decomposition Method
• • •
HPC Enabled Multi-port Excitation Acceleration
• •
HPC Acceleration for DCRL, ACRL and CG
• •
HPC 2D Skew Parallel Processing
• • •
HPC Enabled Parallel Processing
• • • • • •
