Brochures

2023 R2 Capabilities Chart

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• Full Support ▲ Limited Capability ▪ Requires more than 1 product 57 / ELECTRONICS Maxwell HFSS SIwave Q3D Extractor Icepak Motor-CAD EMA3D Cable EMA3D Charge Nuhertz FilterSolutions Electronics Pro Electronics Enterprise POWER AND SIGNAL INTEGRITY BOARD SIMULATION CAPABILITIES SPISIM Com and USB-C Compliance • SPISIM IBIS AMI Generation • Synopsys HSPICE Integration • • Cadence PSPICE Support • • Electromagnetically Circuit Driven Field Solvers • • • RLCG PARASITIC EXTRACTION DCRL, ACRL & CG Solver • • • IC Packaging RLCG IBIS Extraction for Signals & Power • • Touchpanel RLCG Unit Cell Extraction • • Adaptive Meshing for Accurate Extraction • • • Bus Bar RLCG Extraction • • • • Power Inverter & Converter Component Extraction • • 3D Component Library • • Reduced RLCG Matrix Operations • • SPICE Equivalent Modeling Export • • • DCRL & ACRL Joule Heating Analysis with Icepak • • Macro-Modeling (Network Data Explorer) • • 2D Cable Modeling Toolkit • • ELECTRONICS COOLING Multi-Mode Heat Transfer • • Steady-State and Transient • • CFD Analysis • • Turbulent Heat Transfer • • Multiple-Fluid Analysis • • Species Transport • • Solar Loading • • Reduced Order Flow and Thermal • •

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