Issue link: https://resources.randsim.com/i/1512034
5 Electrical Drive Modeling through a Multiphysics System Simulation Approach // The motor is modeled f rom either Maxwell 2-D/3-D or RMxprt, an electrical machine design tool that provides accurate analytical models for all standard electrical machine types (single and three-phase induction motor, synchronous machine, switched reluctance motor, generic rotating machine). You can quickly configure and set up a very large set of parameters allowing accurate description of the machine. The software enables editing rotor and stator slots, stator windings configuration, conductor data (material), coil arrangement and more (Figure 10). The example here is a BLDC motor. Finally, thermal management of the active electronic part must be consid- ered along with the power electronics. Cooling of the power inverter was modeled in a 3D electronics thermal design tool (in this case, Ansys Icepak). The ROM created f rom the high-fidelity 3D model results is thoughly incorporated into Simplorer simulation (Figure 11). As a result, you can validate the behavior of each subcircuit and mutual interactions between physics, then identify the key points of enhancement early in the design by monitoring and analyzing essential quantities, such as junction temperature of semiconductors or three-phase currents (Figure 12). / Summary The Ansys system simulation strategy has been demonstrated through a combination of multiphysics system simulation with embedded software development for power electronics. Through a comprehensive system solution known as Simplorer, integration of detailed robust accurate models coming f rom field tools can be realized for each physics domain to obtain early diagnosis and study of the whole product optimization. The approach is extensible with more-detailed models (3D) of different hardware components, depending on the need and analysis case. Figure 10. View of Ansys RMxprt electrical machine model with mechanical load. Figure 12. View of three-phase currents (left) and junction temperature of IGBTs and diodes (right). Figure 11. ROM (linear time invariant model) of cooling system for power electronics.