Issue link: https://resources.randsim.com/i/1509637
STRUCTURES / Sherlock Overview // 2 CAPABILITIES FLEXURE/BENDING Determines if any post-soldering processes could induce excessive flexure that would cause component cracking, pad cratering or solder fracture. CONFORMAL COATING/ POTTING Allows the user to evaluate the effect of staking compounds, underfills, conformal coatings and potting materials on the reliability of electronic hardware. CAE INTERFACE Import to and export from finite element analysis (FEA) solvers. THERMAL DERATING Flags devices being used outside of the specified operation or storage temperature range. TRACE MODELING Allows the user to explicitly model all PCB features over the entire circuit board or in a particular region. Can be exported for current density, thermal or structural analysis. CERAMIC CAPACITOR WEAROUT Predicts time to failure for ceramic capacitors (MLCC). ELECTROLYTIC CAPACITOR WEAROUT Predicts time to failure for aluminum liquid electrolytic capacitors. INTEGRATED CIRCUIT WEAROUT Predicts failure rate and end of life of integrated circuits using degradation algorithms for electromigration, time-dependent dielectric breakdown, hot carrier injection and negative bias temperature instability. HEATSINK EDITOR Create pin- and fin-based heatsinks using fill-in fields and drop-down menus and attach them to components or PCBs. DFMEA Allows the user to semi-automate the creation of a component-level DFMEA. Can be exported into any form/spreadsheet, including SAE J1739. SOLDER FATIGUE 1D, BOARD-LEVEL Predicts solder fatigue reliability under thermomechanical and mechanical environments for all electronic parts (die attach, BGA, QFN, TSOP, chip resistor, through hole, etc.). SOLDER FATIGUE, 3D, SYSTEM-LEVEL Incorporates the effect of system-level mechanical elements (chassis, module, housing, connectors, etc.) on solder fatigue analysis. SHOCK AND VIBRATION ANALYSIS Predicts the natural frequency, displacement, strain and reliability under shock and vibration over a range of temperatures (-55 C to 125 C). PLATED THROUGH-HOLE (PTH) FATIGUE Predicts fatigue of plated through holes/vias in circuit boards using IPC TR-579 calculations. CONDUCTIVE ANODIC FILAMENT (CAF) Sherlock benchmarks the printed board design and quality processes to industry best practices to identify risk of CAF failures. PCB/BGA SUBSTRATE STACKUP Captures stackup from output files (Gerber, ODB++, IPC-2581). Automatically calculates weight, density and in-plane and out-of-plane modulus, coefficient of thermal expansion and thermal conductivity. ANSYS, Inc. www.ansys.com ansysinfo@ansys.com 866.267.9724 © 2020 ANSYS, Inc. All Rights Reserved.