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Electrothermal Mechanical Stress Reference Design Flow for Printed Circuit Boards and Electronic Packages //
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Our reference design flow can help you solve multiphysics DC thermal and
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/ References
1
G. Refai-Ahmed, H. Shi, M. Keshavamurthy, S. Shah, D. Ostergaard, B. Boots, T.
Pawlak, & S.G. Pytel; "Electronic PCB & Package Thermal Stress Analysis"; IEEE
Electronics Components and Technology Conference, May 31-June3, 2016.
/ Additional Reading
S.G. Pytel, L. Williams, M. Raju; "Package and Board Power Integrity Design with ANSYS SIwave-PI"
Pytel, S. G. Solving DC Power Distribution Problems.
http://www.ansys.com/Resource+Library/Technical+Briefs/Solving+DC+Power+Distribution+Problems
Pytel, S. G. Thermal Solutions for 3-D IC, Packages and Systems.
http://www.ansys.com/Resource+Library/Technical+Briefs/Thermal Solutions+for+3-D+IC,+Packages+and+System
Pytel, S. G. High-Performance Electronic Design: Predicting Electromagnetic Interference.
http://www.ansys.com/Resource+Library/White+Papers/High-Performance+Electronic+Design+-+Predicting+Electromagnetic+
Interference
http://www.ansys.com/Products/Simulation+Technology/Electronics/Signal+Integrity/ANSYS+SIwave
Creative Commons Attribution-ShareAlike 3.0 Printed Circuit Board From Wikipedia, the f ree encyclopedia.
Figure 24. PCB Flip Chip Attachment Process and Thermal
Cycling to Assess Cumulative Damage in Components
