Finally, the DfM analysis examines the manufacturing
flow by asking several questions:
Does the board use single- or double-sided
surface mount technology (SMT)?
Are through-hole parts used?
Are they wave or selective soldered?
Are any parts hand soldered?
Are we employing no-clean processing?
Does the assembly require conformally coating?
What type of coating?
How does it compare to different thermal
environments?
Are caustic chemicals in the use
environment?
How can we apply the coating?
The Definitive Guide to an Electronic Assembly Design Review / 12
6
Design for Manufacturability (DfM) (cont.)
