Investigate PCB Thermal Performance with
2022 Enhancements to Ansys SIwave
WHITEPAPER
Companies that produce printed circuit boards (PCBs) with high-speed
digital signals have dealt with heat challenges for decades. Today,
with supply chain issues creating extremely long lead times and an
increasingly remote workforce, the challenges have compounded.
Gone are the days when one could pull the team in, test a board, note
its failure, adjust the design, and try again. That process is becoming
simply too time consuming, expensive, and risky. One has more to gain
now than ever before by using simulation to supercharge the design
and testing process before final benchtop validations.
